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DISCRETE SEMICONDUCTORS
DATA SHEET
M3D883
BAT54CM Schottky barrier double diode
Product specification 2003 Nov 11
Philips Semiconductors
Product specification
Schottky barrier double diode
FEATURES * Low forward voltage * Leadless ultra small plastic package (1.0 x 0.6 x 0.5 mm) * Boardspace 1.17 mm2 (approx. 10% of SOT23) * Power dissipation comparable to SOT23. APPLICATIONS * Ultra high-speed switching * Voltage clamping * Protection circuits * Mobile communications, digital (still) cameras, PDAs and PCMCIA cards. DESCRIPTION Planar Schottky barrier double diode encapsulated in a SOT883 leadless ultra small plastic package.
Top view
handbook, halfpage
BAT54CM
PINNING PIN 1 2 3 anode (a1) anode (a2) common cathode DESCRIPTION
1 3 2 cathode mark
MARKING
1
TYPE NUMBER BAT54CM
MARKING CODE S3
3 2 Bottom view
MLE232
Fig.1
Simplified outline (SOT883) and symbol.
ORDERING INFORMATION PACKAGE TYPE NUMBER NAME BAT54CM - DESCRIPTION leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.5 mm VERSION SOT883
2003 Nov 11
2
Philips Semiconductors
Product specification
Schottky barrier double diode
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL VR IF IFRM IFSM Tstg Tj Ptot Note 1. Refer to SOT883 standard mounting conditions (footprint); FR4 with 60 m copper strip line. THERMAL CHARACTERISTICS SYMBOL Rth j-a Note 1. Refer to SOT883 standard mounting conditions (footprint), FR4 with 60 m copper strip line. Soldering Reflow soldering is the only recommended soldering method. ELECTRICAL CHARACTERISTICS Tamb = 25 C unless otherwise specified. SYMBOL Per diode VF forward voltage see Fig.2; IF = 0.1 mA IF = 1 mA IF = 10 mA IF = 30 mA IF = 100 mA IR Cd Note 1. Pulsed test: tp 300 s; 0.02. continuous reverse current diode capacitance VR = 25 V; note 1; see Fig.3 f = 1 MHz; VR = 1 V; see Fig.4 240 320 400 500 800 2 10 PARAMETER CONDITIONS MAX. PARAMETER thermal resistance from junction to ambient note 1 CONDITIONS VALUE 500 PARAMETER continuous reverse voltage continuous forward current repetitive peak forward current non-repetitive peak forward current storage temperature junction temperature total power dissipation (per package) Tamb 25 C; note 1 tp 1 s; 0.5 tp < 10 ms CONDITIONS - - - - -65 - - MIN.
BAT54CM
MAX. 30 200 300 600 +150 150 250 V
UNIT mA mA mA C C mW
UNIT K/W
UNIT
mV mV mV mV mV A pF
2003 Nov 11
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Philips Semiconductors
Product specification
Schottky barrier double diode
BAT54CM
MSA892
10 3 handbook, halfpage IF (mA) 10 2
(1) (2) (3)
10 3 IR (A) 10 2
(2) (1)
MSA893
10
10
1
(1)
(2) (3)
1
(3)
10 1
10 1 0 0.4 0.8 VF (V) 1.2 0 10 20 VR (V) 30
(1) Tamb = 125 C. (2) Tamb = 85 C. (3) Tamb = 25 C.
(1) Tamb = 125 C. (2) Tamb = 85 C. (3) Tamb = 25 C.
Fig.2
Forward current as a function of forward voltage; typical values.
Fig.3
Reverse current as a function of reverse voltage; typical values.
handbook, halfpage
15
MSA891
Cd (pF)
10
5
0
0
10
20
VR (V)
30
f = 1 MHz; Tamb = 25 C.
Fig.4
Diode capacitance as a function of reverse voltage; typical values.
2003 Nov 11
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Philips Semiconductors
Product specification
Schottky barrier double diode
PACKAGE OUTLINE Leadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.5 mm
BAT54CM
SOT883
L 2 b e
L1
3
b1
1
e1
A A1
E
D
0
0.5 scale
1 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A (1) 0.50 0.46 A1 max. 0.03 b 0.20 0.12 b1 0.55 0.47 D 0.62 0.55 E 1.02 0.95 e 0.35 e1 0.65 L 0.30 0.22 L1 0.30 0.22
Note 1. Including plating thickness OUTLINE VERSION SOT883 REFERENCES IEC JEDEC JEITA SC-101 EUROPEAN PROJECTION ISSUE DATE 03-02-05 03-04-03
2003 Nov 11
5
Philips Semiconductors
Product specification
Schottky barrier double diode
DATA SHEET STATUS LEVEL I DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2)(3) Development DEFINITION
BAT54CM
This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
II
Preliminary data Qualification
III
Product data
Production
Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
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Philips Semiconductors - a worldwide company
Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
(c) Koninklijke Philips Electronics N.V. 2003
SCA75
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R76/01/pp7
Date of release: 2003
Nov 11
Document order number:
9397 750 11909

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